• Branchen
  • 3D-Drucker
  • Materialien
Menu
 

ELECTRONICS PACKAGING SYMPOSIUM | Binghamton, NY

Our 35th annual Electronics Packaging Symposium will take place Sept. 4-5, 2024, at the Binghamton University Innovative Technologies Complex. We will focus on various aspects of electronic packaging and how advance packaging is evolving toward a Chiplet future. We will update this webpage with the session titles and keynote speakers. We look forward to seeing you in September.

Veranstaltungen

Zurück
Zurück zur Übersicht
Vor