- UK’s first Lithoz CeraFab Multi 2M30 has been installed at Compound Semiconductor Applications (CSA) Catapult headquartered in Newport, South Wales
- This ground-breaking 3D printer can combine materials unlike ever before, opening the door to entirely new multifunctional applications
- With its research on this cutting-edge 2M printer, CSA Catapult will contribute to a new dimension of multi-material 3D printing for compound semiconductor packaging and integration
3rd May, 2022: Vienna, Austria. Lithoz GmbH, global market and innovation leaders in ceramic 3D printing, has recently delivered the UK’s first CeraFab Multi 2M30 in Wales, UK. This machine is a true technological breakthrough as it combines ceramic with ceramic, metal or polymers even in one single layer. It creates composites giving birth to entirely new multi-functional applications for research and industry using 3D printing.
The CeraFab Multi 2M30 is an LCM-based printer with two separate vats, can combine multiple materials within one single layer and can vary the material composition layer-by-layer.
Such material compositions allow for a mixture of differing properties in one single layer and component – thus paving the way to a completely new dimension of application possibilities and enabling a variety of design concepts unimaginable until now.
The CeraFab Multi, launched in 2020, has already been used to achieve new successes such as the strongest 3D-printed alumina ever produced. With this being the first multi-material 3D printer of its kind in the UK, both Lithoz and CSA Catapult, recipient of the machine, are looking forward to further innovation once it is operational later in the year.
‘The CeraFab Multi 2M30 3D printer, part of the DER Investment in state-of-the-art equipment, is a valuable addition to our advanced semiconductor integration and packaging capability,’ stated Dr. Jayakrishnan Chandrappan, Head of Packaging at CSA Catapult, which helps optimise advanced electronic systems and delivers industrial research organisation to benefit companies in the UK. ‘This acquisition will help us develop novel 3D-printed multi-material parts for high-power and high-frequency microelectronics packages, and the multi-material printing facilities will drive energy-efficient, compact and affordable packaging.’