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Lithoz announces the CeraMax Vario V900 3D printer with all-new LIS technology for large ceramic parts in full densities

  • Lithoz will launch their brand-new CeraMax Vario V900 with Laser-Induced Slipcasting (LIS) technology at the upcoming ceramitec (21-24th June)
  • This groundbreaking new technique has been specifically designed for producing large ceramic parts with thick walls and full densities unlike anything achievable so far using other ceramic 3D methods
  • LIS technology uses water-based slurries of oxide and non-oxide ceramics and can easily process dark ceramics such as silicon carbide
  • Together with their new printer, Lithoz launched a completely new website

9th June 2022: Vienna, Austria. Lithoz GmbH, global market and innovation leaders in ceramic 3D printing, has revealed all details about their all-new CeraMax Vario V900, which will be launched at the coming ceramitec (21-24th June).

The innovative machine is the world’s first 3D printer that can produce large ceramic components with thick walls and full densities using oxide and non-oxide ceramics. It can also easily process dark ceramics such as silicon carbide. This latest advancement not only fills an important market gap but also marks the beginning of a new era for Lithoz and the 3D printing world.

With the ability to apply up to 1.000 µm slurry per layer in less than a minute and a build envelope of up to 250 x 250 x 290 mm, the CeraMax Vario V900 uses innovative Laser-Induced Slipcasting (LIS) technology, enabling additive manufacturing using industrial water-based suspensions with very low organic binder contents. Thanks to the much-simplified debinding process, wall thicknesses can be realized that have not yet been possible in other ceramic 3D printing technologies. At ceramitec, Lithoz will present some impressive components already demonstrating the printer’s potential.

Green parts printed with the CeraMax Vario V900 are machineable without any restrictions, meaning they can therefore be easily reintroduced into the traditional ceramic process chain. For ceramic producers, LIS technology is the ideal technological entry point into ceramic 3D printing as it perfectly combines the full 3D design flexibility plus a considerably accelerated ceramic shaping process with economical water-based suspensions which stay very close to familiar standard slurries.

In the LIS technology powering the CeraMax Vario V900, the water-based slurry solution completely absorbs the laser beam. Due to treatment being purely heat-induced, even dark ceramics such as silicon carbide can be processed without issues or loss of desired properties. Silicon carbide, one of the most sought-after technical ceramics for both mechanical properties and width of possible applications, is notoriously difficult to process via any additive manufacturing technology that involves the use of light for curing of slurry materials. The new LIS technology finally opens the door to the processing of this innovative material.

A central element of the CeraMax Vario is the database-supported storage and management of all process data, enabling seamless documentation of print jobs. Optional software upgrades allow for even better parameter control or adjustment, as well as the structuring of your production data and the possibility of real-time process monitoring via remote video transmission.

As from now, the brand new LIS technology employed in the CeraMax Vario V900 will perfectly complement Lithoz’s product portfolio. The company’s market leading Lithography-based Ceramic Manufacturing (LCM) technology will remain the number one choice for realizing complex structures, ultra-precise details or thin walls. LIS fills another important market area and will take on the role of 3D printing larger ceramic parts while still maintaining all desired ceramic properties.

Visit Lithoz at their Booth 234, Hall C1 at ceramitec and have a look at their brand-new website providing an intuitive user journey to learn all about this powerful new technology.

CeraMax Vario V900 technical specifications:

  • Building envelope (x / y / z): up to 250 x 250 x 290 mm
  • Layer thicknesses: between 200 – 1,000 µm
  • Precision optics: F-Theta lens and high-speed scanner
  • Light Source: CO2 Laser
  • CO2 Laser Spot Diameter (1/E2): ca. 0.5 mm
  • Scan speed / Scan strategy: up to 8m/s, flexibly adjustable to part design
  • Dimensions (L x W x H): 1.85 x 0.95 x 2.20 m
  • IIoT & Industry 4.0 ready

Written in co-operation with 3dpbm.

Lithoz Contact: Alice Elt +43 660 1563231/ [email protected]

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